Highly efficient LED chip mass bonding with a yield rate of 99.99% or higher.

Large area, high-speed bonding, leading the industry in production efficiency.

Closed-loop temperature control ensures bonding temperature stability.

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the process of welding repair.

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality. AOI system is optional to confirm the success rate of welding.

The zoom laser system can be used, proportionally scaling to accommodate different chip sizes.

High cutting precision.

Cutting dimensional accuracy<±5μm.

Cutting taper < 5μm.

Cutting edge thermal impact < 10 μm.

Modular design, separation of loading & unloading mechanism and transfer module.

Automated wafer replacement using a robotic arm, with an overall equipment accuracy of ±1 μm.

Laser control system, High quality optical system, the spot uniformity≥95%.

The laser spot is less than 2μm, the working distance is 10.48mm, the chip cutting path width is 4μm~10μm, and the heat affected zone is less than 2μm.

The chip electrical conductivity yield is greater than 98%, single crystal rate is greater than 99%(single crystal spacing expansion deviation value can be as small as 10μm).

The cutting verticality is less than 2°, the minimum size can be cut 0204, the cutting thickness is 50~170μm.

Simplex double suction cups (simultaneously loading and unloading).

It is used for removing the adhesive material after the Mini LED module is sealed and for dressing the solder pad after the crystallization of each process segment. It is compatible with products of different thicknesses and sizes.

With micron - level light spots, it can efficiently remove Mini LED packaging glue of all sizes without damaging adjacent chips and pads. The self - developed chip removal system creates a clean repair environment, significantly boosting the repair yield.