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Products
Micro LED/Mini LED Laser Mass Welding Equipment
Hymson Laser
Products
OVERVIEW
Product Description
Micro LED/Mini LED Laser Mass Welding Equipment
Massive bonding equipment for chips in the Mini LED/Micro LED module manufacturing process
Before Welding
After Welding
Mini LED Direct Display
ADVANTAGE
Product Advantages
High-efficiency LED chip massive welding, yield can reach more than 99.99%
High-speed welding in large area, leading the industry production efficiency
Closed-loop temperature control to ensure bonding temperature stability
Basic Information
Equipment size:
length× width× height: 1680mm× 1840mm× 2030mm (excluding three-color lamp, dust collector, chiller)
Maximum stroke:
X axis 600mm× Y axis 500mm× Z axis 60mm
Maximum processing size:
200mm×200mm
Equipment weight:
2t
Processed products:
Mini/Micro LED
Product Performance
Positioning accuracy:
±2μm
Repeatability accuracy:
±1μm
Processing speed:
10mm/s
Laser type/power:
infrared laser/4000W
Utilization rate:
0.98
Yield:
99.99%
Model classification
HR-WNR3A1
Product Brochure Download
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