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Hymson Laser
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Products
OVERVIEW
Product Description
Micro LED/Mini LED Laser Mass Welding Equipment
Massive bonding equipment for chips in the Mini LED/Micro LED module manufacturing process
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Before Welding -
After Welding -
Mini LED Direct Display
ADVANTAGE
Product Advantages
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High-efficiency LED chip massive welding, yield can reach more than 99.99%
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High-speed welding in large area, leading the industry production efficiency
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Closed-loop temperature control to ensure bonding temperature stability
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Basic Information
- Equipment size:length× width× height: 1680mm× 1840mm× 2030mm (excluding three-color lamp, dust collector, chiller)
- Maximum stroke:X axis 600mm× Y axis 500mm× Z axis 60mm
- Maximum processing size:200mm×200mm
- Equipment weight:2t
- Processed products:Mini/Micro LED
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Product Performance
- Positioning accuracy:±2μm
- Repeatability accuracy: ±1μm
- Processing speed:10mm/s
- Laser type/power:infrared laser/4000W
- Utilization rate:0.98
- Yield:99.99%
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Model classification
- HR-WNR3A1
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