Mainly includes pad printing, inkjet printing, pole ear cutting, pole ear size detection, grooving glue, PCM assembly/welding, pole ear bending, pole ear adhesive, glue wrapping, Pogo pin test, appearance inspection

The equipment adopts single station single rack mode. Has high agility

The MES system controls production in fully closed-loop. The whole line can be equipped with digitalization to observe various indicators of the line in real time.

Most comprehensive experience in button battery pack technology in the industry. The equipment is compatible with various types of nickel sheet mounting and welding.

Mainly include Busbar mounting, bending and welding, adhesive tape mounting, soft plate assembly and bending, laser welding, laser etching, Pogo pin, waterproof film removal, testing, liquid leakage and appearance inspection.

The whole line adopts high-speed transmission line design, UPH ＞ 1200. Seperated operation can be conducted by single machine and single process

The MES system controls production in fully closed-loop. The whole line can be equipped with digitalization to observe various indicators of the line in real time.

The thickness of thick glass cutting crack can be ≤ 15mm when the cutting crack is completed in one piece.

Bessel processing technology is adopted with small focus spot, small edge collapse and high efficiency.

Customized special high pulse energy (max: ≤ 2.5mj) laser processing has small thermal effect.

Support automatic loading and unloading for capacity expansion.

Being used for Micro LED chip removal, welding and leveling compatible with different sizes of chips and substrates, leveling accuracy up to sub-micron level.

The chip glue of Micro LED as small as 5μm is removed by matching micron light spots, without damaging adjacent chips, pads and other layers.

Through the self-developed AI integration system, the repair location can be automatically identified to avoid the repair failure caused by misjudgment and ensure product safety.

Efficient LED chip massive welding, yield up to 99.99% or more.

Large area high-speed welding, compatible with larger substrate size, leading industry production efficiency.

Closed loop temperature control, to ensure the stability of bonding temperature.

High precision alignment leveling system, with leading vision algorithm, to ensure the high reliability of welding process.

Coaxial visual positioning system for high-precision positioning of chip placement.

Accurately detects pad height, enabling repair of residual solder on the pad without pad damage.

Offers flexible selection of laser or mechanical die ejection.

Compatible with pre-film and post-film repair processes.