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Hymson Laser
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Products
3C Battery
Power/Transformer
VCM
Electronic Atomization
PCB/SMT
Precision Structural Parts
Brittle Material
Dispensing
Laser
- Laser Cutting
- Laser Welding
- Laser Surface Treating
- Core Luminous
- Laser Control System
- Laser Plastic Welding
Automation
- Precision Assembly
- Machine Vision
- Roll-to-roll
Intelligent Manufacturing
- PLC Software Framework Platform
- PC Software Framework Platform
- Digital Twin
- Digital simulation
- Virtual commissioning
Basic Technology
- Advanced Testing
- Physical Simulation Computing Platform
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View ProductsAuto PCB Laser Marking Machine-
Support MES, unmanned and digital workshop system docking.
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Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.
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Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.
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Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.
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View ProductsDouble Station Laser Cutting Machine-
Stress-free cutting avoids product damage caused by stress of material.
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Dust free and environmental friendly.
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The section of cutting surface is smooth and neat without burr and carbonization.
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Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.
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View ProductsPCB/FPC Online Laser Cutting Machine-
No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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View ProductsAuto Laser Cutting Machine-
No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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View ProductsMicro LED Intelligent Versatile Laser Removal Equipment-
Being used for Micro LED chip removal, welding and leveling compatible with different sizes of chips and substrates, leveling accuracy up to sub-micron level.
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The chip glue of Micro LED as small as 5μm is removed by matching micron light spots, without damaging adjacent chips, pads and other layers.
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Through the self-developed AI integration system, the repair location can be automatically identified to avoid the repair failure caused by misjudgment and ensure product safety.
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View ProductsMicro LED Mass Welding Equipment-
Efficient LED chip massive welding, yield up to 99.99% or more.
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Large area high-speed welding, compatible with larger substrate size, leading industry production efficiency.
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Closed loop temperature control, to ensure the stability of bonding temperature.
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High precision alignment leveling system, with leading vision algorithm, to ensure the high reliability of welding process.
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