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Hymson Laser
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Products
OVERVIEW
Product Description
Double Station Laser Cutting Machine
Online laser cutting equipment applicable to the cutting and formation of epoxy resin (PCB), flexible plate (FPC), soft and hard combination plate (RF).
1/3
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FG Board -
Soft and Hard Combination Plate (RF) -
Camera Modules
ADVANTAGE
Product Advantages
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Stress-free cutting avoids product damage caused by stress of material.
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Dust free and environmental friendly.
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The section of cutting surface is smooth and neat without burr and carbonization.
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Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.
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Quick type change. The cutting program can be directly called after saving the format without changing any parameters.
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Fast cutting speed and dual-station structure. Greatly improves product processing efficiency. Has significant advantages such as high precision, low cost, and outstanding market competitiveness.
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Basic Information
- Machine dimension：L1370*W1400*H1670（without tricolor light）
- PCB、FPC dimension：350X350mm
- PCB thickness：<2mm
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Product Performance
- Laser type：Nanosecond, Picosecond, imported laser
- Laser wavelength：355nm/532nm
- Laser power：UV nanosecond (15W-30W) Green (35W-60W)
- Machining accuracy：±20μm
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Model classification
- HP –C3535D
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