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Hymson Laser
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Products
Body Sheet Metal Processing
Automobile Electronic Module
Automotive Display Module Solution
Laser
- Laser Cutting
- Laser Beam Welding
- Laser Surface Treating
- Core Luminous
- Laser Control System
Automation
- Precision Assembly
- Machine Vision
- Roll-to-roll
Intelligent Manufacturing
- PLC Software Framework Platform
- PC Software Framework Platform
- Digital Twin
- Digital simulation
- Virtual commissioning
Basic Technology
- Advanced Testing
- Physical Simulation Computing Platform
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View ProductsAuto PCB Laser Marking Machine
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Support MES, unmanned and digital workshop system docking.
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Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.
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Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.
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Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.
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View ProductsDouble Station Laser Cutting Machine
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Stress-free cutting avoids product damage caused by stress of material.
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Dust free and environmental friendly.
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The section of cutting surface is smooth and neat without burr and carbonization.
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Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.
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View ProductsPCB/FPC Online Laser Cutting Machine
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No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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View ProductsAuto Laser Cutting Machine
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No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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View ProductsMicro LED Laser Mass Transfer Machine
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This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.
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Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.
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The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.
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Automatic transfer of RGB chips.
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View ProductsHigh Precision Laser Automatic Wafer Cutting Equipment
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Realize high-precision cutting of wafer brittle materials without chipping and cracks
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Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses
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Compatible with different types and sizes of products
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