Support MES, unmanned and digital workshop system docking.

Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.

Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.

Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.

Stress-free cutting avoids product damage caused by stress of material.

Dust free and environmental friendly.

The section of cutting surface is smooth and neat without burr and carbonization.

Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.

No dust. Minor pollution to the environment

The cut surface section is smooth without burr and carbonization.

Non-stress cutting. Can avoid product damage caused by material stress.

Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.

No dust. Minor pollution to the environment

The cut surface section is smooth without burr and carbonization.

Non-stress cutting. Can avoid product damage caused by material stress.

Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.

This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.

Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.

The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.

Automatic transfer of RGB chips.

Realize high-precision cutting of wafer brittle materials without chipping and cracks

Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses

Compatible with different types and sizes of products