Support MES, unmanned and digital workshop system docking.

Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.

Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.

Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.

Stress-free cutting avoids product damage caused by stress of material.

Dust free and environmental friendly.

The section of cutting surface is smooth and neat without burr and carbonization.

Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.

No dust. Minor pollution to the environment

The cut surface section is smooth without burr and carbonization.

Non-stress cutting. Can avoid product damage caused by material stress.

Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.

No dust. Minor pollution to the environment

The cut surface section is smooth without burr and carbonization.

Non-stress cutting. Can avoid product damage caused by material stress.

Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.

The laser spot is less than 2μm, the working distance is 10.48mm, the chip cutting path width is 4μm~10μm, and the heat affected zone is less than 2μm.

The chip electrical conductivity yield is greater than 98%, single crystal rate is greater than 99%(single crystal spacing expansion deviation value can be as small as 10μm).

The cutting verticality is less than 2°, the minimum size can be cut 0204, the cutting thickness is 50~170μm.

Simplex double suction cups (simultaneously loading and unloading).

High cutting precision.

Cutting dimensional accuracy<±5μm.

Cutting taper < 5μm.

Cutting edge thermal impact < 10 μm.