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Hymson Laser
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Products
Product Description
The equipment is mainly used for laser micromachining of material surface. The ultra-fast laser marking machine developed for 3C manufacturing industry is suitable for ceramic surface precision marking, mobile phone glass cover plate surface marking treatment, camera protection lens ink removal, PVD deplating, PCB/FPC grooving and other applications. Equipment equipped with ultrafine laser, integrated high-speed, high-precision optical processing system, independent technology, processing path optimization system, ultrafine laser application greatly improves the processing quality of products, high processing precision, small heat-affected area, processing edge without burr and residue, good long-term stability. Can be a variety of materials for precision marking, drilling, cutting and grooving and other micro processing.
Product Advantages
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Equipped with high-performance infrared, green or ultraviolet picosecond laser, power and pulse width can be adjusted, high processing efficiency, can process a variety of material products.
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Marble base and high precision linear motor, full closed-loop feedback control, high precision, good stability.
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Equipped with high precision CCD visual positioning system, can accurately identify and grab all kinds of marks, ensure the precision of processing position.
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Professional marking software, support a variety of document formats, stable performance, easy to use.
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Basic Information
- Laser wavelength: 355nm/532nm/1064nm
- Maximum laser power:5W/8W/10W/15W/25W/50W
- Repetition frequency: 100kHz-10000KHz
- Engraving line speed: ≤10000mm/s
- Engraving range: 100x100mm
- Repetition accuracy: ±0.003mm
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Product Performance
- Cooling method:Water cooling
- Force requirement:220V±22V/50Hz
- Machine power:2.5KW
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Model classification
- HP-KPL
