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Auto brittle material picosecond laser cutting machines
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Auto brittle material picosecond laser cutting machines

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Primary application: mobile phone Sapphire single and double camera protective chip cutting.
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Equipment Feature:
  • This model can be used for single unit operation, and used as fully automated material loading and unloading cutters. 
  • Marble precision platforms are used for stable load bearing and resistance to corrosion.
  • Imported high power laser is used for machining in quicker speeds, with high stability and long service life.
  • High negative pressure vacuum machine adsorption products to ensure the stability of positioning.
  • With built-in power stabilizers to securely protect equipment and electric appliances on a stable and reliable basis.
  • There is provision of automatic alignment CCD and visual lenses, which can accurately identify various Mark points.
  • There is cutting software that is independently researched and developed, and customers can select customization functions. 
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