This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.

Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.

The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.

Automatic transfer of RGB chips.

Realize high-precision cutting of wafer brittle materials without chipping and cracks

Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses

Compatible with different types and sizes of products

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the welding repair process

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality

Optional AOI system to instantly confirm welding success rate

Coaxial visual positioning system, high-precision positioning chip position

Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad

Flexibly select laser or mechanically remove chips

Coaxial visual positioning system for high-precision positioning of chip placement.

Accurately detects pad height, enabling repair of residual solder on the pad without pad damage.

Offers flexible selection of laser or mechanical die ejection.

Compatible with pre-film and post-film repair processes.

Highly efficient LED chip mass bonding with a yield rate of 99.99% or higher.

Large area, high-speed bonding, leading the industry in production efficiency.

Closed-loop temperature control ensures bonding temperature stability.