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Hymson Laser
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Products
Body Sheet Metal Processing
Automobile Electronic Module
Automotive Display Module Solution
Laser
- Laser Cutting
- Laser Welding
- Laser Surface Treating
- Core Luminous
- Laser Control System
Automation
- Precision Assembly
- Machine Vision
- Roll-to-roll
Intelligent Manufacturing
- PLC Software Framework Platform
- PC Software Framework Platform
- Digital Twin
- Digital simulation
- Virtual commissioning
Basic Technology
- Advanced Testing
- Physical Simulation Computing Platform
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View ProductsPlastic Laser Welding Machine-
Good sealing performance.
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Weld strength equal to or greater than the base material.
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Low power consumption, no noise, no consumables, no maintenance.
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Laser, visual, temperature measurement three - in - one welding joint.
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View Products3D Laser cutting machine-
Adopt robot + fiber laser 3D cutting instead of die stamping and mechanical engraving and milling for cutting edge punching of shaped pipe fittings.
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Effective save moulds, shorten the product development cycle, improve processing efficiency and achive fexible production.
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Realize ring cutting, save the time of indexing machine rotation or manual secondary clamping, high efficient processing.
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Can be equipped with dual robot workstations to realize dual-station material change and linked cutting at the same time, the cutting efficiency has greatly improved.
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View ProductsBrittle Material Cutting Equipment-
The laser spot is less than 2μm, the working distance is 10.48mm, the chip cutting path width is 4μm~10μm, and the heat affected zone is less than 2μm.
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The chip electrical conductivity yield is greater than 98%, single crystal rate is greater than 99%(single crystal spacing expansion deviation value can be as small as 10μm).
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The cutting verticality is less than 2°, the minimum size can be cut 0204, the cutting thickness is 50~170μm.
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Simplex double suction cups (simultaneously loading and unloading).
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View ProductsComposite Film Laser Cutting Equipment-
High cutting precision.
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Cutting dimensional accuracy<±5μm.
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Cutting taper < 5μm.
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Cutting edge thermal impact < 10 μm.
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View ProductsMicro LED Intelligent Versatile Laser Removal Equipment-
Being used for Micro LED chip removal, welding and leveling compatible with different sizes of chips and substrates, leveling accuracy up to sub-micron level.
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The chip glue of Micro LED as small as 5μm is removed by matching micron light spots, without damaging adjacent chips, pads and other layers.
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Through the self-developed AI integration system, the repair location can be automatically identified to avoid the repair failure caused by misjudgment and ensure product safety.
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View ProductsMicro LED Mass Welding Equipment-
Efficient LED chip massive welding, yield up to 99.99% or more.
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Large area high-speed welding, compatible with larger substrate size, leading industry production efficiency.
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Closed loop temperature control, to ensure the stability of bonding temperature.
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High precision alignment leveling system, with leading vision algorithm, to ensure the high reliability of welding process.
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