Products

Brittle Material Cutting Equipment

OVERVIEW

Product Description

Brittle Material Cutting Equipment

The application scenario of this equipment can be applied to cutting brittle materials such as sapphire; LED chip invisible cutting.

ADVANTAGE

The laser spot is less than 2μm, the working distance is 10.48mm, the chip cutting path width is 4μm~10μm, and the heat affected zone is less than 2μm.
The chip electrical conductivity yield is greater than 98%, single crystal rate is greater than 99%(single crystal spacing expansion deviation value can be as small as 10μm).
The cutting verticality is less than 2°, the minimum size can be cut 0204, the cutting thickness is 50~170μm.
Simplex double suction cups (simultaneously loading and unloading).
High cutting efficiency.
The model can be selected: semi-automatic/fully automatic.

Basic Information
- Equipment Size：2000mm(L)*2350mm(W)*2100mm(H) (Excluding EFU, auxiliary equipment,indicator lights)
- Maximum Stroke：X Axis 300mm x Y Axis 450mm
- Equipment Weight：2000Kg
- Processing Type：Glass/wafer/chip cutting
Product Performance
- Repeatability Accuracy：±0.75μm
- Position Accuracy：±1.5μm
- Speed：≤1000mm/s
- Z Axis Repeatability Accuracy：±1.5μm
- Z Axis Position Accuracy： ±3μm