Stable performance, can work for a long time.

Support PLT, PCX, DXF, BMP and other files, directly use the SHX, TIF library.

Support industry 4.0 and intelligent manufacturing, and create a new production mode.

Small size, easy to integrate.

It is used for removing the adhesive material after the Mini LED module is sealed and for dressing the solder pad after the crystallization of each process segment. It is compatible with products of different thicknesses and sizes.

With micron - level light spots, it can efficiently remove Mini LED packaging glue of all sizes without damaging adjacent chips and pads. The self - developed chip removal system creates a clean repair environment, significantly boosting the repair yield.

Realize high-precision cutting of wafer brittle materials without chipping and cracks

Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses

Compatible with different types and sizes of products

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the welding repair process

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality

Optional AOI system to instantly confirm welding success rate

Coaxial visual positioning system, high-precision positioning chip position

Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad

Flexibly select laser or mechanically remove chips

Marble precision platform, stable bearing, corrosion resistance.

The machining platform is driven by linear motor and optical ruler in closed loop, which is easy to maintain and has high precision.

Infrared picosecond laser, small processing heat affected area, especially suitable for fine cutting.

Imported vacuum generator is adopted to ensure the stability of adsorption and positioning of products.